Method of and arrangement for cleaning, activating and metallizing of bore holes in conductor boards
US4789405A · kind A · utility
14Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1986 |
| Grant date | Dec 6, 1988 |
| Priority date | — |
| Expiry date | Aug 4, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S239/22
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Cleaning, activating and metallizing of bore holes in conductor boards is performed by supplying a liquid treatment medium in form a standing wave onto a lower side of the conductor board by a surge line which is formed as a nozzle arranged under a transporting path and substantially normal to a transporting direction of the horizontally guided conductor board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.