Method and apparatus for mounting electronic parts
US4790069A · kind A · utility
13Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1986 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | Apr 28, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method and apparatus for mounting an electronic part (11) on a circuit board (28). When the part is mounted, a distance between the under surface of a part maintaining section (12) and the circuit board (38) is measured. Determination that the electronic part (11) is normally mounted on the circuit board (28) is made by comparing the measured distance with the thickness of the electronic part (11) measured in advance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.