Process for producing printed wiring board
US4790894A · kind A · utility
43Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1987 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | May 6, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.