Multilayer printed wiring board and method for producing the same
US4791239A · kind A · utility
42Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1987 |
| Grant date | Dec 13, 1988 |
| Priority date | — |
| Expiry date | May 29, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed wiring board produced by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) through a first insulation laminate (12), and a second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern through through studs (15) and a second insulation laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.