Thermal technique for simultaneous testing of circuit board solder joints
US4792683A · kind A · utility
51Cited by
4References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1987 |
| Grant date | Dec 20, 1988 |
| Priority date | — |
| Expiry date | Jan 16, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for inspecting the electronic integrity of solder joints by repetitive pulse-heating the solder joints with radiant energy and determining the temperature oscillation of pulse-heated solder joints by measuring the infrared emissions from the solder joints during heating and non-heating periods. Advantageously, the exposed solder joints of a circuit board can be tested all at one time by pulse-heating the entire circuit board. The temperature oscillation of each joint can be compared to the temperature oscillations of corresponding standard solder joints of known good electronic integrity on properly operating boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.