Ultra high frequency circuit with low parasite capacities
US4792773A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1986 |
| Grant date | Dec 20, 1988 |
| Priority date | — |
| Expiry date | Sep 17, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultra high frequency circuit constructed in hybrid or integrated form whose parasite capacities are greatly reduced. The ultra high frequency circuit has, besides the components, at least one component fixing metallization and at least one microstrip formed by a metal track, on a first face of a dielectric substrate and, a ground plane metallization on a second face of the substrate. The ultra high frequency circuit is fixed to the base of a case. In order to reduce the parasite capacities formed between metallizations, the second metallized face of the substrate is locally demetallized, in line with the fixing metallization, and an air layer is introduced between the demetallized substrate and the base of the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.