Trimming passive components buried in multilayer structures
US4792779A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1988 |
| Grant date | Dec 20, 1988 |
| Priority date | — |
| Expiry date | Apr 18, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique is disclosed for trimming resistors and other passive circuit components buried in hybrid multilayer circuit structures. For example, resistors (13) are formed between two dielectric layers (11, 19) of a hybrid multilayer circuit structure (10). The multilayer circuit structure with the buried resistors is appropriately processed to provide a fired multilayer circuit structure. Trimming of the buried resistors is accomplished with a laser beam that cuts through dielectric material of the fired circuit structure to selectively remove part of the resistive material of the buried resistors. The values of the buried resistors may be tested with conductive elements (15, 17) that are conductively coupled to the buried resistors. The disclosed technique also contemplates the trimming of other buried passive circuit components such as capacitors, and further contemplates the use of other trimming methods such as abrasive, air jet, or water jet trimming.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.