Solder joint
US4793543A · kind A · utility
20Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1987 |
| Grant date | Dec 27, 1988 |
| Priority date | — |
| Expiry date | Aug 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power component such as a power transistor is mounted on an insulating substrate of, e.g., beryllia by using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lands, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimized if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.