Bonding method and adhesive useful for the method
US4793886A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1987 |
| Grant date | Dec 27, 1988 |
| Priority date | — |
| Expiry date | Jul 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for bonding two objects by means of the following two adhesives: PA0 (A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound, and a 1,1-disubstituted diene compound; and PA0 (B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.