Method and apparatus for monolayering of wafers
US4794833A · kind A · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1985 |
| Grant date | Jan 3, 1989 |
| Priority date | — |
| Expiry date | Mar 20, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/6481
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for monolayering sliced wafer-like articles such as fruit or vegetable slices to enhance further product processing. The apparatus includes a slice catcher in cooperative relationship with a centrifugal slicer such that discharged product slices impinge onto the slice catcher inner surface and are captured by a flow of liquid passing over the slice catcher inner surface. The slices are controllably separated, conveyed and deposited in monolayered fashion on a conveyor for subsequent processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.