Method and apparatus for optimizing the cutting of raw boards into product boards
US4794963A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 5, 1987 |
| Grant date | Jan 3, 1989 |
| Priority date | — |
| Expiry date | Oct 5, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/6523
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for optimizing the yield from a raw board, having defects randomly located therein, and for cutting the raw board optimally into product boards of predetermined specification, thereby cutting out any defects. The apparatus includes an adjustable fence located at a defect detection station, oriented along a path and movable transversely to the path. Located at the station are laser lines for temporarily forming lines lengthwise on the raw board. These laser lines cooperate with the fence to determine clear and full widths of the raw board. Also disclosed is a method for using the apparatus for optimizing the yield of the raw board. The clear width and full width information is transmitted to a computer while any waste portion is cut off and as all defects between the laser lines are being marked by an operator. In the meantime, the computer calculates an optimum solution for product to be cut from the board. A sub-board is then cut from the raw board lengthwise, according to the solution calculated by the computer. This leaves a remainder board which is returned to the station while the sub-board is cross-cut into one or a number of product boards as specified in the ma…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.