Peripheral/area wire bonding technique
US4796078A · kind A · utility
141Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1987 |
| Grant date | Jan 3, 1989 |
| Priority date | — |
| Expiry date | Jun 15, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.