Process for the preparation of polyimide film
US4797307A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1987 |
| Grant date | Jan 10, 1989 |
| Priority date | — |
| Expiry date | May 14, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process for the production of a polyimide film having an increased adhesiveness which includes the steps of: evenly coating a surface treating solution which contains a heat-resistant surface treating agent of aminosilane type, epoxysilane type or titanate type in an amount not less than 0.5 wt. % on a surface of a solid film comprising an aromatic polymer composition which contains 100 parts by weight of an aromatic polyamic acid and 5-150 parts by weight of an organic polar solvent and heating the solid film having the coated surface treating solution at a temperature of 100.degree.-600.degree. C., to imidize the polyamic acid constituting the solid film as well as to dry the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.