Thin film magnetic head having solder-bonded protective plate
US4797765A · kind A · utility
13Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1988 |
| Grant date | Jan 10, 1989 |
| Priority date | — |
| Expiry date | Apr 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02P25/024
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic head comprising a thin film magnetic head structure and a protective plate thereon such as glass or the like has an improved bonding interlayer between them. The interlayer is formed by fusing together registered solder areas which have been preformed respectively on the mirror image positions of the upper surface of the head structure and the lower surface of the protective plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.