Optical component mounting
US4798439A · kind A · utility
44Cited by
11References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 1986 |
| Grant date | Jan 17, 1989 |
| Priority date | — |
| Expiry date | Mar 21, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An improved technique for mounting optical components on a substrate comprises providing each component with a dedicated heating element on the component itself to permit controlled and well-localized heating of solder on the substrate during fixing. In the example illustrated the optical component is an optical fibre carrier comprising fibre (10), carrier plate (12) and heating element (20), which itself comprises an ink film resistor (22) deposited on a ceramic chip (21) having metallized electrical contacts (23).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.