Thermoplastic molding materials

US4798855A · kind A · utility

Assignee

• BASF SE

Inventors

• Dietrich Lausberg · Ludwigshafen, DE
• Gerd Blinne · Worms, DE
• Peter Ittemann · Lampertheim, DE
• Gerhard Heinz · Bad Dürkheim, DE
• Erhard Seiler · Ludwigshafen, DE
• Manfred Knoll · Monsheim, DE

Key dates

• Filing date: May 13, 1987
• Grant date: Jan 17, 1989
• Expiry date: May 13, 2007

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/93
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA1 (A) from 2 to 97.9% by weight of a nylon, PA1 (B) from 2 to 97.9% by weight of a polyaryl ether sulfone PA1 (C) from 0.1 to 30% by weight of a polymeric component having hydroxyl groups and in addition PA1 (D) from 0 to 50% by weight of a rubber impact modifier and PA1 (E) from 0 to 60% by weight of reinforcing fillers.