Plastic package for an IC card
US4798946A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1988 |
| Grant date | Jan 17, 1989 |
| Priority date | — |
| Expiry date | Feb 3, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2024/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A plastic package for an IC card comprises a first package section and a section package section, both of which have a flat base and a rim which extends around the periphery of the base and projects therefrom. A groove is formed in the rim of the first package section, and a projection which fits into the groove is formed in the rim of the second package section. A bonding agent is applied to the inside of the groove, and the two package sections are combined with the top surfaces of the rims abutting and the projection inserted into the groove. In one form of the invention, the groove is preferably larger than the projection by an amount sufficient to prevent bonding agent from being forced out of the groove. In another form of the invention, grooves for storing bonding agent which overflows from the grooves are formed in the top surface of one of the rims on either side of the groove and projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.