Metallizing paste
US4799958A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1986 |
| Grant date | Jan 24, 1989 |
| Priority date | — |
| Expiry date | Oct 23, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/258
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric material, such as ethyl cellulose, and a solvent, such as terpineol. The paste preferably includes frit material, such as one or more of alumina, cerium fluoride, bismuth oxide and silica. The paste may also include manganese and/or nickel. There is also disclosed a semi-conductor package made using the metallization paste. The package includes a conductive attachment area, conductive feed-through paths, conductive vias and a conductive external underside, all of which are formed using the metallization paste in various formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.