Dip molding process and article
US4800116A · kind A · utility
19Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1987 |
| Grant date | Jan 24, 1989 |
| Priority date | — |
| Expiry date | Feb 3, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249992
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A dip molding process for making an integral article having a solid inner surface and a foamed outer cover in which a hot mold is dipped into a solid plastisol which is partially fused before being dipped into a foamable plastisol which is then formed, fused and bonded to the solid plastisol to form an integral article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.