Microelectronic components and thick-film hybrid circuits

US4802061A · kind A · utility

Assignee

• BASF SE

Inventors

• Michael Portugall · Monsheim, DE
• Hans-Josef Sterzel · Schifferstadt, DE
• Gerd Blinne · Worms, DE
• Heinz-Dieter Vondenhagen · Bischofswerda, DE
• Erhard Seiler · Ludwigshafen, DE
• Hans-Friedrich Schmidt · Eurasburg, DE
• Sybille Von Tomkewitsch · Pöcking, DE

Key dates

• Filing date: Jul 24, 1987
• Grant date: Jan 31, 1989
• Expiry date: Jul 24, 2007

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31786
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.