Method of encapsulating TFEL panels with a curable resin
US4802873A · kind A · utility
14Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1987 |
| Grant date | Feb 7, 1989 |
| Priority date | — |
| Expiry date | Oct 5, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B33/04
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solid filler material is used to encapsulate active TFEL components supported by a substrate and disposed within a cavity. The cavity is created by affixing a rear cover plate to the substrate. The filler material is injected into the cavity as a liquid but cures to a solid under the influence of heat. This provides an effective moisture barrier and enhances the structural integrity of the panel rendering it immune to problems caused by changes in air pressure or caused by vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.