Semiconductor device and process for producing the same
US4803543A · kind A · utility
38Cited by
10References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 4, 1981 |
| Grant date | Feb 7, 1989 |
| Priority date | — |
| Expiry date | Dec 4, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.