Thermoinsulating moldings containing a porous, inorganic thermoinsulating material and having an organopolysiloxane coating thereon
US4804579A · kind A · utility
0Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 1988 |
| Grant date | Feb 14, 1989 |
| Priority date | — |
| Expiry date | Feb 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to thermoinsulating moldings containing porous, inorganic thermoinsulating materials and having an organopolysiloxane coating thereon, in which an uncoated thermoinsulating molding is coated with a diorganopolysiloxane containing rod-shaped styrene-(meth)acrylate copolymers which are obtained from a free radical copolymerization of styrene and (meth)acrylate in the presence of the diorganopolysiloxane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.