Method of soldering with heated fluid and device therefor
US4805827A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Jul 15, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/012
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Device for delivering heated fluid to the sides of a component to melt solder at terminals disposed at the periphery of the component. The device includes a nozzle for delivering heated fluid generally in a first direction to the sides of the component, and a baffle disposed within or above the nozzle for directing the heated fluid generally laterally with respect to the first direction prior to delivery of the heated fluid toward the sides of the component. The nozzle has downwardly extending sides, and the sides are dimensioned so that the component can be accommodated within the nozzle. The baffle produces good distribution and mixing of heated air above and about the terminals, and this avoids the generation of hot spots, and produces simultaneous or essentially simultaneous melting of the solder at all of the leads to facilitate quick and convenient attachment of the component to or removal of the component from a printed circuit board. The downwardly extending sides of the nozzle are preferably vertically oriented with respect to the printed circuit board while the lower edges thereof are disposed at least below the body of the component such that heated fluid is forced throu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.