Interconnect lead frame for thermal ink jet printhead and methods of manufacture
US4806106A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Apr 9, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame member having a plurality of conductive leads or fingers extending at a predetermined angle with respect to the final plane of interconnection. During the interconnection process, these leads or fingers are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame in a single plane of interconnection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.