Textured polyimide film
US4806395A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Feb 24, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One or both surfaces of a polyimide sheet are uniformly and completely textured and can be coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The surface is textured by contacting the polyimide sheet with a one-phase solution of an amine, an alkali metal hydroxide, a water miscible alcohol and water. The copper and nickel or cobalt layers of the laminate can be strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.