Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
US4806409A · kind A · utility
28Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | May 20, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.