Method of providing electrical contact to a semiconductor cathode, cathode so produced, and electron tube provided with such cathode
US4806818A · kind A · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1987 |
| Grant date | Feb 21, 1989 |
| Priority date | — |
| Expiry date | Sep 14, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J1/308
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A contact for a semiconductor cathode is produced by thermally bonding leads consisting of one of the metals Ag, Au, Cu and one of the metals Ta, Ti, V. Such a contact does not exhibit degradation when the cathode, after mounting in a vacuum tube, is heated several times to approximately 850.degree. C. for cleaning purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.