Method and equipment to solder printed-circuit assemblies
US4807794A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 27, 1988 |
| Grant date | Feb 28, 1989 |
| Priority date | — |
| Expiry date | Jan 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.