Multiple-substance alloy for targets of cathode sputtering apparatus
US4808373A · kind A · utility
5Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1986 |
| Grant date | Feb 28, 1989 |
| Priority date | — |
| Expiry date | Oct 20, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further contains non-gold alloys of aluminum, copper and preferably an element of the group of Co, Ni, Ga, Ti, In, Cd, Sn, Fe and Pd.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.