Chip carrier and method of fabrication
US4809135A · kind A · utility
30Cited by
7References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1987 |
| Grant date | Feb 28, 1989 |
| Priority date | — |
| Expiry date | Nov 20, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic chip carrier comprising a ceramic substrate and a copper lead frame directly bonded to the substrate, the lead frame being formed to provide leads in fringe regions beyond the edges of the substrate which are connected together by a removable rim and adapted to be suitably formed to make electrical and mechanical contact with the conductive runs on a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.