Pressure sensor
US4809555A · kind A · utility
Inventor
Key dates
| Filing date | Sep 3, 1986 |
| Grant date | Mar 7, 1989 |
| Priority date | — |
| Expiry date | Sep 3, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S73/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor has a metal housing. The housing has a closed-off and fluid-filled pressure space. A diaphragm partitions the pressure space off from the environment and transmits pressures derived therefrom to the fluid. A pressure-sensitive chip of semiconducting material is exposed to the pressure of the fluid and has a piezoresistant and anisotropic effect. Connectors, metal rods for instance, extend pressure-tight and electrically insulated from the metal housing into the pressure space. The connectors can be connected to an electric processing circuit. The pressure-sensitive chip is connected by bonds. To provide a pressure sensor that will be cheaper to manufacture, less sensitive to malfunction, and more precise, the pressure sensor is provided with a base plate of aluminum nitride. At least some areas of its surface are metallized. The pressure-sensitive chip is soldered to the base plate within a metallized area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.