Electroplating process
US4810333A · kind A · utility
40Cited by
2References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1987 |
| Grant date | Mar 7, 1989 |
| Priority date | — |
| Expiry date | Dec 14, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/92
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.