Patent · US Expired

System for improved flaw detection in polycrystalline diamond

US4810447A · kind A · utility

6Cited by
8References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 4, 1985
Grant dateMar 7, 1989
Priority date
Expiry dateFeb 4, 2005

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB01J2203/0685
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Disclosed is an improvement enabling a more reliable detection of flaws in polycrystalline diamond compacts by x-ray imaging and especially for compacts used for wire drawing dies. In an embodiment, wire die compacts are prepared having a polycrystalline diamond core disposed within a metal carbide annulus. In the core are uniformly dispersed less than five (5) percent by weight particles such as tungsten carbide which initially have an average particle size substantially less than the diamond particles used to form the polycrystalline mass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.