Method for controlling electroless magnetic plating
US4810520A · kind A · utility
241Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1987 |
| Grant date | Mar 7, 1989 |
| Priority date | — |
| Expiry date | Sep 23, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1675
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved method for controlling magnetic quality of electroless plating in which the plated substrates are subjected to magnetic film deposition for a true plating time determined by offsetting the total plating time by the activation time, the activation time being the time for surface potential transients to decrease and steady state surface potential to occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.