Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
US4811166A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1986 |
| Grant date | Mar 7, 1989 |
| Priority date | — |
| Expiry date | Jul 2, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon. The coating is thicker on at least one of the two lateral core surfaces so that heat collected from the semiconductor device at the top surface of the thermally conducting coating is efficiently transferrred via the lateral surface or surfaces on the core to the portion of the thermally conducting coating on the bottom surface of the member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.