Temperature control apparatus for thin film deposition system
US4811687A · kind A · utility
9Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 14, 1987 |
| Grant date | Mar 14, 1989 |
| Priority date | — |
| Expiry date | Dec 14, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/541
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus adapted for use in high vacuum, thin-film deposition system for controlling the temperature of moving substrate holder. Preferably, such temperature control apparatus comprises a fixed, temperature-controlled, thermally conductive member, and liquid heat transfer medium (preferably liquid gallium) for thermally coupling such member to the substrate holder as it moves through a vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.