Method of producing a semiconductor device having a light transparent window
US4812420A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1987 |
| Grant date | Mar 14, 1989 |
| Priority date | — |
| Expiry date | Sep 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
Abstract
A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.