Tab-type semiconductor process
US4812421A · kind A · utility
57Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1987 |
| Grant date | Mar 14, 1989 |
| Priority date | — |
| Expiry date | Oct 26, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A TAB (Tape Automated Bonding) process uses single-layer tapes to form a semiconductor structure. Beam leads on a metal tape are "inner-lead bonded" to a chip. Each chip site on a specially-formed plastic tape has a central portion and a peripheral portion which are bonded to the chip so that the central portion forms a protective cover over the chip and the peripheral portion acts as a support for the beam leads during probe testing, excising and forming operations, etc. The bottom surface of the chip preferably remains uncovered so that it can, if appropriate, be electrically connected to ground or another potential.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.