Semiconductor element sealing structure
US4812897A · kind A · utility
10Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1987 |
| Grant date | Mar 14, 1989 |
| Priority date | — |
| Expiry date | Sep 1, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.