Method of growing cobalt silicide films by chemical vapor deposition
US4814294A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1987 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | Jul 30, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to an improved method of depositing cobalt silicide films on a substrate by chemical vapor deposition at a temperature range of about 100.degree.-400.degree. C. By employing two separate precursors of, preferably, for cobalt, comprised of cobalt carbonyls having a vapor pressure sufficiently high to provide a cobalt stream to support chemical vapor deposition, and for silicon, comprised of silanes or halogenated silanes having a vapor pressure sufficient to support chemical vapor deposition, a cobalt silicide film is grown. The ratio of silicon to cobalt is controlled precisely by varying the substrate temperature while the process is being conducted. In a more specific aspect, the films are grown on substrates of either gallium arsenide or silicon. In the case of silicon, epitaxial growth of the cobalt silicide film is achieved by specific control of process parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.