Super integration circuit device having a plurality of IC-chip equivalent regions formed on a single semiconductor substrate
US4814639A · kind A · utility
2Cited by
0References
7Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 29, 1988 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | Aug 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/923
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
At least first and second IC-chip equivalent regions having functions available from conventional one-chip IC device are formed on a single semiconductor substrate. An output of the second region is supplied to an input terminal of the first region. The output of the second region is also delivered at an external terminal in response to a test signal through a multiplexer or a bidirectional buffer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.