Surface mounted electronic device with selectively solderable leads
US4814947A · kind A · utility
6Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 17, 1988 |
| Grant date | Mar 21, 1989 |
| Priority date | — |
| Expiry date | Feb 17, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mounted device (SMD) having leads selectively solderable so that those portions of the leads extending down along the sides of the device body are not solderable. Thus, during attachment to a mother board by wave soldering, solder does not collect in the spaces between the leads and the device body, and both solder joint reliability and strength are improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.