Encapsulating compositions containing ultra-pure, fused-silica fillers
US4816299A · kind A · utility
7Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1987 |
| Grant date | Mar 28, 1989 |
| Priority date | — |
| Expiry date | May 20, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S65/901
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions for encapsulating electronic components are provided which comprise a blend of a curable resin and an ultra-pure silica filler. The filler is composed of fused silica granules which are prepared from a gel of a silicon-containing organic compound, such as TEOS, and which have a uranium content of less than about 0.1 parts per billion and a thorium content of less than about 0.5 parts per billion. The compositions can be readily manufactured in commercial quantities at reasonable costs and are particular well-suite for encapsulating components, such as, high density RAMs, which are sensitive to alpha particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.