Photocurable composition
US4816496A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 1985 |
| Grant date | Mar 28, 1989 |
| Priority date | — |
| Expiry date | May 30, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/922
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are photocurable compositions which comprise PA1 (A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule; PA1 (B) an organometallic compound and PA1 (C) a silicon compound capable of generating silanol group by irradiation of light, or comprise PA1 (A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule; PA1 (E) an epoxy compound; PA1 (F) an organic phosphorus compound; and PA1 (G) a photosensitizer. The compositions of the present invention have excellent film characteristics such as good adhesion property, light resistance, heat resistance and weathering resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.