Patent · US Expired

Magnetron cathode sputter coating apparatus

US4818358A · kind A · utility

10Cited by

3References

16Claims

0Family size

Assignee

Leybold-Heraeus GmbH · DE

Inventors

Peter Hubert · Lemwerder, DE
Barbara Kussel · Rodgau, DE
Peter Wirz · Unterkulm, CH

Key dates

Filing date	Nov 12, 1987
Grant date	Apr 4, 1989
Priority date	—
Expiry date	Nov 12, 2007

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/35
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

In a cathode sputtering apparatus, in order to achieve a very uniform utilization of the target and a high-quality coating on the substrate, the cathode is provided on its side of the target facing away from the substrate with a flat plate on which a plurality of magnets are disposed in rows, the magnets of the individual rows parallel to one another being at approximately equal distances apart and having the same polarity. Moreover, the magnetic of the one row are offset by a dimension g from the magnets of the adjacent row, so that, in the area of the target provided with the coating material, when the cathode is used in a chamber with suitable gas pressure and with a voltage of any desired frequency is applied, plasma tubes form which are like serpentinely curved racetracks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.