Bonding method employing polyamide oligomer-epoxy polymer adhesives
US4820367A · kind A · utility
4Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1987 |
| Grant date | Apr 11, 1989 |
| Priority date | — |
| Expiry date | Jun 1, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions for the preparation of thermosetting or thermoplastic polymers, which compositions comprise a mixture of at least one polyepoxide and at least one polyamide oligomer, wherein the oligomer is a primary monoamine, an alpha,omega-primary or -secondary diamine, an alpha,omega-diacid or an alpha-primary amine,omega-acid, together with process for preparing polymers and the uses of such materials for molding and for adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.