Fabrication of CPI layers
US4820376A · kind A · utility
67Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1987 |
| Grant date | Apr 11, 1989 |
| Priority date | — |
| Expiry date | Nov 5, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/257
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.