Method of eliminating a fern-like pattern during electroplating of metal strip
US4822457A · kind A · utility
1Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1988 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Jan 25, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is provided for eliminating a fern-like pattern on metal strip being electroplated with metal or metal-alloy coatings. The method includes contacting the to be plated surface of the strip with sufficient additional electrolyte solution to substantially eliminate non-uniformity of a film carried thereon from a prior treatment, such additional electrolyte being in contact with said surface for at least 0.1 second prior to and continuing until arrival of said surface at a point directly facing the adjacent edge of a first electrically energized anode within an electrolytic cell for the plating thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.