Electrically conductive, potentially adhesive composition
US4822523A · kind A · utility
19Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 16, 1987 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Oct 16, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0162
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to electrically conductive potentially adhesive compositions and to films formed from these compositions which are capable of being employed in particular for the adhesive bonding of the surfaces of electronic devices. These compositions are characterized in that they comprise a thermoplastic polyblock organopolysiloxane copolymer with elastomeric properties and particles whose surface at least is electrically conductive and, if appropriate, a solvent or diluent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.